Global Chemical Mechanical Planarization Market is estimated to
surpass ~US$ 9 Bn by 2027: TMR
Key Highlights of Global Chemical Mechanical Planarization Market
The global chemical mechanical planarization (CMP) market was valued at ~US$ 4.5
Bn in 2018 and is anticipated to expand at a CAGR of ~8% during the forecast period.
Chemical mechanical planarization is a standard manufacturing process used in the
semiconductor industry to fabricate integrated circuits and memory disks. Expansion in
the semiconductor industry is estimated to propel the chemical mechanical planarization
Asia Pacific accounts for a major share of the global chemical mechanical planarization
market, led by the strong demand for semiconductors in the region.
Key Drivers of Global Chemical Mechanical Planarization Market
Chemical mechanical planarization is a process that removes topography from silicon
oxide, metal, and polysilicon surfaces. It is a planarization step utilized in deep sub-
micron IC manufacturing. Chemical mechanical planarization has been widely used in the
semiconductor industry for oxide dielectric and metal layer planarization. It has also been
employed for the fabrication and assembly of micro electro-mechanical systems (MEMS).
The global semiconductor market stood at US$ 481 Bn in 2018 and is estimated to
expand at a CAGR of 4.6% during the forecast period, to reach US$ 575 Bn by 2022.
The demand for chemical mechanical planarization in the semiconductor industry is
primarily driven by mobile Internet devices (MIDs), personal computers (PCs), as well as a
wide range of other electronic applications, including high-performance computing and
There has been a significant shift in the demand for PCs and MIDs in IC devices in the
semiconductor industry. The demand for MIDs is largely consumer-based, while that for
PCs is primarily enterprise-based. This shift has led to fluctuations in the semiconductor
In terms of demand, the sem