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・Company Overview
・Characteristics of the system
・Background of and effects brought by introduction of
the system
１．Outline of implementation
System overview
Implementation schedule
Introduction cost
２．Explanation of scheduling system
３．About periphery systems
４．System issues
５．Wrap up
SCHEDULING SYSTEM FOR
SEMICONDUCTOR MANUFACTURING
February 15, 2007
Casio Micｒonics Co., Ltd.
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Smart ＆ Fine Technologies
OUTLINE OF COMPANY
Founded:
July 25, 1987
Lines of business:
Production base:
BUMP Business
Film Devices Business
Ohme Works （No. 1 & No. 2 plants）
Yamanashi Works （No. 1 & No. 2 plants）
Capital:
2,992 Million yen (as of March 31, 2006)
Turnover:
No. of employees:
25.1 billion yen (March 2006)
630 (March 2006)
JASDAQ
6760
C Micro
J stock
Stock exchange:
Securities code:
Newspaper listing name:
Newspaper listing column:
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Smart ＆ Fine Technologies
OUTLINES OF BUSINESS
CONSTANTLY UPHOLDS THE INNOVATION OF
DIGITAL EQUIPMENT WITH MICRO METER BASED UNIQUE
AND REVOLUTIONARY TECHNOLOGIES
Film devices business
ＢＵＭＰ business
Gold BUMP
Solder BUMP/W-CSP
COF/TCP
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Smart ＆ Fine Technologies
FILM DEVICES BUSINESS
Used in large screen
thin type PCs/LCD
televisions for low cost
LC connecting part
PCB
connecting part
Double coating film (PI+Cu)
LC driver
PI
： polyimide
Cu ： copper
〈 COF structure 〉
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Smart ＆ Fine Technologies
BUMP BUSINESS
《 SOLDER BUMP/W-CSP 》
《
GOLD BUMP
》
Constantly evolving
high definition
color LC display
Weight saving for
multifunction mobile information
terminal equipment
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Smart ＆ Fine Technologies
W-CSP APPLICATION EXAMPLES
Example of use（digital camera）
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Smart ＆ Fine Technologies
PRODUCT
CHARACTERISTICS
（１） Wafer inch size
5Φ、6Φ、8Φ、（12Φ）
（２） No. of models
About 100/month
（３） Lot size
Mass production
25 sheets（1～25 sheets）
Proto type
1 sheet ～ 10 sheets
（４） No. of processes
Min. 9 ～ Max. 67
（５） Lead time
Prototype
4 days ～ 14 days
Mass production
7 days ～ 10 days
W-CSP: items handled by the scheduling system
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Smart ＆ Fine Technologies
CHARACTERISTICS OF
MAN