AT&T and Cinterion Wireless Modules Team Up
to Expand the AT&T Connection Kit for Device
Optimized, Easy-To-Use Integration Tools Speed Development Cycle and Time to Market for New 3G M2M
June 22, 2010 08:03 AM Eastern Daylight Time
BELLEVUE, Wash. & DALLAS--(EON: Enhanced Online News)--AT&T* and Cinterion Wireless Modules
today announced the launch of the AT&T Connection Kit For Device Developers with Cinterion Wireless Modules.
Combining Cinterion’s market-leading modules with AT&T’s fastest 3G network and industry-leading service
delivery platform, the quick-start kit contains everything needed to develop HSPA specialty wireless solutions for
machine-to-machine (M2M) applications for virtually any industry or vertical market.
The AT&T Connection Kit program provides the tools and environment necessary to streamline device development
and optimize performance on AT&T’s 3G network. The newest kit leverages Cinterion’s next generation HC25
module, which supports both Quad-Band GSM/GPRS/EDGE and Tri-Band UMTS/HSDPA frequencies for
worldwide functionality, enabling sophisticated enterprise devices and solutions such as PDAs, industrial handhelds
The AT&T Connection Kit also includes AT&T SIM cards, data capacity for testing, access to AT&T Control
Center, powered by Jasper Wireless, and best practice guidelines to bring approved devices to market faster than
ever before. Perhaps most important, users of the AT&T Connection Kit have the peace of mind of working with
M2M industry leaders with more than a decade of experience enabling successful M2M deployments.
“Cinterion believes that virtually all businesses and industries can improve the bottom line with intelligent M2M
wireless technology,” said Peter Fowler, regional president, Americas, Cinterion Wireless Modules. “Together with
AT&T, we’re making it easier than ever for developers to make wireless a reality and accelerate the adoption of
M2M around the world.”
“Our goal is to deliver the power o