THIS LOAN AGREEMENT, dated January 1 st , 2010, made in Hong Kong, by and between:
Party A: Gold Spread Trading Limited, a limited liability company registered in Hong Kong, with its registered
address at: 1301 Bank of America Tower, 12 Harcourt Road, Central Hong Kong, Legal Representative: Li
Party B: GreenChek Technology Inc. a Nevada, USA incorporated company, with its corporate address at:
Suite 2450 – 101 California Street, San Francisco, CA, USA 94111.
WHEREAS , Party B desires to receive funding for the manufacture of its emissions reduction units; and Party A
desires to provide Party B with such loan in USD. For the purpose to define the rights and obligations of both
parties hereto, Party A and Party B enter into this Loan Agreement (this "Agreement") on the principle of equality
and mutual benefit.
AMOUNT AND TERM OF LOAN
1.1. Party A agrees, subject to the terms and conditions of this Agreement, to extend interest-free loan in
USD to Party B (the "Loan"). The aggregate amounts of the Loan shall be USD 32,500.00.
1.2. Party B shall repay in full to Party A the Loan that Party A actually extends to Party B by issuing
1,625,000 common shares of Party B’s capital stock.
METHOD OF BORROWING AND USE OF LOAN PROCEEDS
Immediately upon execution of this Agreement, Party A shall make available to Party B an amount not
more than USD10,000.00 of the Loan to the following account designated by Party B:
Party B shall not use such Loan for any purposes in violation of Hong Kong laws and regulations, otherwise
Party A may at any time require Party B to repay the Loan. All subsequent amounts will be on an as need basis
and not to exceed more than USD 10,000.00 at any given time.
GreenChek Technology Inc.
Bank of Montreal
Swift No.: BOFMCAM2
PARTY B's REPRESENTATIONS AND