Note: Portions of this exhibit indicated by "[*]" are subject to a confidential treatment request, and have been
omitted from this exhibit. Complete, unredacted copies of this exhibit have been filed with the Securities and
Exchange Commission as part of this Company's confidential treatment request.
EBV ELEKTRONIK GmbH
Trinity 2 ASIC DEVELOPMENT AGREEMENT
(Agreement Number AS011)
This ASIC DEVELOPMENT AGREEMENT referred to, together with all exhibits hereto, and any agreed
separate writings, as the "Agreement" entered in to by and between EBV Elektronik GmbH ("EBV') and Airspan
Communications Ltd ("Customer") with a place of business at Cambridge House, Oxford Road, Uxbridge,
Middlesec UK, shall be effectives as the 6th July 2000 ("Effective Date"). The parties hereby agree as follows:
This Agreement sets forth the terms and conditions by which EBV ELEKTRONIK GmbH ("EBV") and
Customer agree to engage in the design and development of one or more application specific integrated circuit
ASIC Products ("ASIC") as defined below, to be manufactured solely by LSI Logic Corporation of 1551
McCarthy Blvd Milpitas California USA (`LSI"). Furthermore, this Agreement governs the terms and conditions
by which the Customer will be licensed with certain intellectual property of LSI defined below as LSI IP, in
connection with the design and development of the ASIC. As agreed herein, EBV will provide Customer with
engineering support and assistance, and Customer with co-operate in regard to protection of the LSI IP. EBV
will act as a distributor of LSI in all manufacturing work to be undertaken pursuant to this Agreement.
2.1 "Customer Specifications" means the information including, without limitation, software, schematics, netlist,
micro code, designs, or techniques supplied by Customer to EBV for use in the Program.
2.2 "ASIC" mans the device(s) described in Exhibit A hereto, or otherwise agreed in writing, to be manufactured
solely by LSI, including pr