Cinterion Wireless Modules Adds Automotive
LGA Technology to its Market Leading M2M
Portfolio
CTIA Wireless 2010
March 23, 2010 08:03 AM Eastern Daylight Time
LAS VEGAS--(EON: Enhanced Online News)--Cinterion Wireless Modules, the global leader in cellular machine-
to-machine (M2M) communication modules, today announced its new AGS3 automotive module at CTIA Wireless
2010. The new module strengthens Cinterion’s market-leading M2M product portfolio, adding land grid array
(LGA) technology to its automotive grade modules.
“We continue to push the M2M envelope, providing innovative modules for a broad range of budgets and
applications worldwide,” said Norbert Muhrer, CEO and president, Cinterion Wireless Modules. “There’s
tremendous opportunity and demand in the automotive sector and AGS3 with LGA mounting enables cost-effective,
process manufacturing for eToll, eCall, fleet management and other large scale telematics applications.”
Optimized for Automotive Plus LGA Innovation
AGS3, Cinterion’s sixth generation automotive module, is optimized for peak performance and rugged automotive
application environments. It includes solderable LGA surface mounting technology for efficient, fully automated
manufacturing and process consistency as well as advanced telematics features and functionality.
AGS3 meets the requirements of the European eCall initiative and is ideal for ITS applications such toll collect,
telematics, fleet management and emergency call and roadside assistance solutions. It provides GPRS class 12 data
speeds on 2G Quad-Band frequencies (850/900/1800/1900 MHz) for worldwide coverage.Other highlights of
AGS3 include:
l Cinterion LGA 119 form factor mounting
l Full TCP/IP support (TCP, UDP, HTTP, FTP, SMTP, POP3)
l Industrial Interfaces (USB, 2x serial, SPI, I2C)
l RLS monitoring / jamming detection
l Advanced temperature management, operating range: -40°C to +85°C
l Latest processor technology: ARM9, 65nm
l Antenna diagnostics as manufacturing support
l SIM ac