We work with you to define the problem, then
generate the most appropriate and useful physical
data from the samples you submit to the lab in
order to provide you with a quality solution. Our
Rockford IL facility holds state of the art laboratory
investigative tools, supported by complementary
capabilities in a network of over 100 Exova
Mechanical Testing of Materials and
This may include: tensile strength, elongation,
yield strength, deflection force and
electromechanical switch characteristics.
Mechanical Testing of Materials & Components at
Temperature: Perform material and device
evaluations at temperatures from 200C to -
40C through the use of a thermal chamber.
Examples include component, connector and
cable insertion and retention forces, switch
Hardness Testing: All types - Rockwell A, B, C, N,
T ; microhardness as well as shore hardness of
plastics and elastomers.
Solderability and Steam Age Testing: Component
and PC board testing for solderability.
X-ray Radiography: Stand alone 1:1 film
photography or real time, digital X-ray
radiography of product or packaged devices
through different orientations.
Optical Microscopy (Metallography): Analysis
of microstructures, corrosion studies, plating
thickness, weld analysis, solder joints, PCB
sections, plated through-hole analysis etc.
Scanning Electron Microscopy with Energy
Dispersive Spectroscopy (SEM/EDS): High
magnification and high resolution photography
with inorganic elemental chemical analysis.
Low vacuum mode available for analysis of
nonconductive materials without gold sputtering.
FTIR (Fourier Transform Infrared) Spectroscopy:
Organic material identification &
characterization Contamination analysis on
electronic devices and electrical contact
Thermal Analysis: Analysis of polymers to
measure degree of cure, glass transition
temperature, weight loss, expansion, dielectric,