Analysis
Capabilities
We work with you to define the problem, then
generate the most appropriate and useful physical
data from the samples you submit to the lab in
order to provide you with a quality solution. Our
Rockford IL facility holds state of the art laboratory
investigative tools, supported by complementary
capabilities in a network of over 100 Exova
laboratories worldwide.
Capabilities include:
Mechanical Testing of Materials and
Components:
This may include: tensile strength, elongation,
yield strength, deflection force and
electromechanical switch characteristics.
Mechanical Testing of Materials & Components at
Temperature: Perform material and device
evaluations at temperatures from 200C to -
40C through the use of a thermal chamber.
Examples include component, connector and
cable insertion and retention forces, switch
characteristics.
Hardness Testing: All types - Rockwell A, B, C, N,
T ; microhardness as well as shore hardness of
plastics and elastomers.
Solderability and Steam Age Testing: Component
and PC board testing for solderability.
X-ray Radiography: Stand alone 1:1 film
photography or real time, digital X-ray
radiography of product or packaged devices
through different orientations.
Optical Microscopy (Metallography): Analysis
of microstructures, corrosion studies, plating
thickness, weld analysis, solder joints, PCB
sections, plated through-hole analysis etc.
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Scanning Electron Microscopy with Energy
Dispersive Spectroscopy (SEM/EDS): High
magnification and high resolution photography
with inorganic elemental chemical analysis.
Low vacuum mode available for analysis of
nonconductive materials without gold sputtering.
FTIR (Fourier Transform Infrared) Spectroscopy:
Organic material identification &
characterization Contamination analysis on
electronic devices and electrical contact
surfaces.
Thermal Analysis: Analysis of polymers to
measure degree of cure, glass transition
temperature, weight loss, expansion, dielectric,
and ther