* Confidential treatment has been granted or requested with respect to portions of this exhibit, and such
confidential portions have been deleted and separately filed with the Securities and Exchange Commission
pursuant to Rule 24b-2 or Rule 406.
TECHNOLOGY LICENSE AND SERVICES AGREEMENT
THIS TECHNOLOGY LICENSE AGREEMENT (the "Agreement"), is dated this 14 day of December, 2000,
and made by and between RAMTRON International CORPORATION ("Ramtron"), a Delaware, USA,
corporation having its principal office at 1850 Ramtron Drive Colorado Springs, Colorado 80921, United States
of America, and Infineon Technologies AG, a German Corporation with a principal place of business at P.O.
Box 800949 Munich, Germany ("Infineon"). Collectively, Ramtron and Infineon may be referred to in this
Agreement as the "Parties", or individually as "Party".
R E C I T A L S
Whereas, Ramtron is the owner of and/or controls certain Ramtron FRAM Technology (defined below) including
certain patents and patent applications related to proprietary design, development and manufacture of
ferroelectric semiconductor technology.
Whereas, Infineon wishes to obtain from Ramtron, and Ramtron is willing to grant Infineon, a license to said
Ramtron FRAM Technology for use in the manufacture and sale of FRAM Products.
Whereas, Infineon is the owner of and/or controls certain Infineon Background Technology including certain
patents and patent applications related to proprietary design, development and manufacture of ferroelectric
Whereas, Ramtron wishes to obtain from Infineon, and Infineon is willing to grant Ramtron, a license to said
Infineon Background Technology and subsequent Infineon Improvements for use in the manufacture and sale of
NOW, THEREFORE, in consideration of the recitals and the mutual covenants contained herein and for good
and valuable consideration, the receipt and adequacy of which are hereby acknowledged, Ramtron and Infineon
hereby agree as follows: