BUEHLER®
FINAL POLISHING
SUSPENSIONS
n Application Specific Suspensions for Superior
Preformance
n Consistent Polishing Results
n High Surface Removal Rates
n Low Deformation
n Full Range of Products for Virtually Any Material
n Convenient Applicator Packaging
BUEHLER®FINALPOLISHINGSUSPENSIONS
Mechanochemical
Polishing Suspensions
MASTERMET® Colloidal
Silica Suspension
• Most general usage mechanochemi-
cal colloidal silica (SiO2) final
polishing suspension
• Fine (0.06 micron) SiO2 particles in an
aqueous base (≈10 pH)
• Fast, effective cutting by SiO2
particles, without deformation
• Especially suited for ferrous and non-
ferrous materials, titanium,
semiconductors, and hard materials
such as ceramics (alumina)
MASTERMET® 2 Colloidal
Silica Suspension
• Fine, noncrystallizing (0.02 micron)
SiO2 particles in an aqueous base
(≈10.5 pH)
• Gentle mechanochemical material re-
moval, without deformation
• Nonstaining
• For use on soft ferrous and
nonferrous materials (copper and
aluminum), ceramics (alumina and
zirconia), and optical fibers (glass and
plastic) where a more gentle
action is desired during final polish
MASTERPOLISH® Final
Polishing Suspension
• A proprietary blend of high
purity 0.05 micron alumina
and colloidal silica
• Provides high material
removal due to a combina-
tion of the high pH (≈9) and
the abrasive blend
• Superior surface finishes
• Effective for ferrous
materials, nickel and
cobalt based materials,
and metal composites
MASTERPOLISH®
2 Final Polishing
Suspension
• Proprietary medium
utilizing a mechanochemical
polishing action
• Superior surface
finishes
• Exceptional removal rates for
ceramic materials due to chemical re-
action with ceramic surface
• Ideal for alumina, glass, sapphire, sili-
con nitride, metal/ceramic
composites, etc.
MASTERPOLISH® 2 is the FInal Polishing Media of
choice for ceramics like Silicon Nitride due to its
high material removal and resultant surface finish.
Time (minutes)
Si3N4 Material Removal (microns)