BUEHLER®
FINAL POLISHING
SUSPENSIONS
n	 Application Specific Suspensions for Superior
Preformance
n	 Consistent Polishing Results
n	 High Surface Removal Rates
n	 Low Deformation
n	 Full Range of Products for Virtually Any Material
n	 Convenient Applicator Packaging
BUEHLER®FINALPOLISHINGSUSPENSIONS
Mechanochemical
Polishing Suspensions
MASTERMET® Colloidal
Silica Suspension
•	Most	general	usage	mechanochemi-
cal	colloidal	silica	(SiO2)	final		
polishing	suspension
•	Fine	(0.06	micron)	SiO2	particles	in	an	
aqueous	base	(≈10	pH)
•	Fast,	effective	cutting	by	SiO2		
particles,	without	deformation
•	Especially	suited	for	ferrous	and	non-
ferrous	materials,	titanium,		
semiconductors,	and	hard	materials	
such	as	ceramics	(alumina)
MASTERMET® 2 Colloidal
Silica Suspension
•	Fine,	noncrystallizing	(0.02	micron)	
SiO2	particles	in	an	aqueous	base		
(≈10.5	pH)
•	Gentle	mechanochemical	material	re-
moval,	without	deformation
•	Nonstaining
•	For	use	on	soft	ferrous	and		
nonferrous	materials	(copper	and	
aluminum),	ceramics	(alumina	and	
zirconia),	and	optical	fibers	(glass	and	
plastic)	where	a	more	gentle		
action	is	desired	during	final	polish
MASTERPOLISH® Final
Polishing Suspension
•	A	proprietary	blend	of	high		
purity	0.05	micron	alumina		
and	colloidal	silica
•	Provides	high	material		
removal	due	to	a	combina-
tion	of	the	high	pH	(≈9)	and	
the	abrasive	blend
•	Superior	surface	finishes
•	Effective	for	ferrous		
materials,	nickel	and		
cobalt	based	materials,		
and	metal	composites
MASTERPOLISH®
2 Final Polishing
Suspension
•	Proprietary	medium		
utilizing	a	mechanochemical	
polishing	action
•	Superior	surface		
finishes
•	Exceptional	removal	rates	for		
ceramic	materials	due	to	chemical	re-
action	with	ceramic	surface
•	Ideal	for	alumina,	glass,	sapphire,	sili-
con	nitride,	metal/ceramic		
composites,	etc.
MASTERPOLISH® 2 is the FInal Polishing Media of
choice for ceramics like Silicon Nitride due to its
high material removal and resultant surface finish.
Time (minutes)
Si3N4 Material Removal (microns)