Zero Defects
Lead Free
Soldering
Dr. Sammy Shina
University of Massachusetts Lowell
UMASS Lowell Consortium
STEP Presentation, 11/3/01
The Problem
• Lead is a toxic material: Past major replacements paint, gasoline
and joining metal piping
• Tin-Lead eutectic solder (63/37)
– used in electronics industry for more than 50 years
– large installed manufacturing base
– history of reliability data
• Major Companies formed NEMI to share resources and
recommend alternatives, $15,000 access to information
• Current Consensus:
There is no drop-in Lead Free replacement for lead
soldering
Lead Free Drivers
Environmental
• European Parliament and Council Directive on Waste
Electrical and Electronic Equipment Directive
(WEEE)
– Bans lead from certain electronic applications by 2008
• Japan
– Japanese Electronics Recycling Law - 2001
– Forbids companies toxic elements that leach into landfills
2/3rd reduction by 2004
Lead Free Drivers
Market Pressure
• German Bluebird
• Proactive stance on lead-free issue by Japanese OEMs
• Hitachi
– Reduced lead usage by 50% since 1997
– All products lead-free by 2001
– current investment US $11.2 million
• Similar stands by Sony, Panasonic, NEC, Toshiba and
Fujitsu
• Lead-free green tagged products already in market in
Europe and Japan
• Claims of increased market share by 12%
• US market anticipated to be flooded by the end of 2002
Lead Free Project Objectives
• Investigate
– safe, reliable, non-toxic and cost effective substitute
• Understand
– material properties
– compatibility of manufacturing processes and
equipment
– long term availability and solder joint reliability.
• Identify Roadblocks
• Select Test Methods
• Develop a standard guideline
– SMT Process Optimization
– Implementation of Lead-Free Process
Project Team
UMASS Lowell-Industry Lead Free Consortium
Project Team
UMASS Lowell-Industry Lead Free Consortium
• Dr. Sammy Shina; Dept. of Mechanical Engineering,
University of Massachusetts, Lowell.
• L. Harriman, C. Pace, Toxic Use Reduction Institute
• C. Pace, STE